91ÊÓƵÍøÕ¾ÎÛ

Mitsubishi Laser’s LVP^LUSII offers performance-enhancing features such as 40CF-R resonator technology, which reduces rise time/fall time of square wave pulse. This is said to provide more consistent beam power during the cutting process and deliver a more consistent edge quality. Additionally, the uniform low-current discharge provides low power stability for improved micro-machining and etching.

The laser features Brilliantcut technology, which can produce a cutting surface roughness equivalent to the typical machined finish. This technology is said to provide optimal processing conditions, reduced taper and reduced discoloring on the heat-affected zone.

Another enhancement is Jet Pierce technology, which decreases part time by allowing material to be pierced faster and more aggressively during small-hole processing. Also, improved height sensor hardware gives the laser twice the tracing ability of the original machine. Maintaining consistent beam quality by using a constant beam length system, the company’s Diamond-Path technology provides cutting stability at speeds as fast as 1,150 ipm across all processing areas.

Mels Eye, the optional Intelligent Process Monitoring System has auto focusing and other detection features to ensure cut quality. Burn detection tracks each cut and when no longer sustained, the laser automatically restarts. Pierce detection increases productivity by eliminating the buffer in conventional oxygen piercing. Plasma detection minimizes scrap in high production runs by tracking plasma and adjusting the machine’s speed as necessary.