Machines
Grinding Machine Accommodates Range of Abrasives
Holroyd’s Zenith 400 helical profile grinding machine has the capability to use three different grinding abrasives: vitrified aluminum or silicon oxide; “diamond hard,” plated CBN; and vitrified, dressable CBN.
Read MoreMarking Fiber Laser Increases Output Power
Trumpf’s TruMark 5070 fiber laser is said to provide increased output power and a higher repetition rate for faster processing speeds.
Read MoreBlade Center Machines Titanium, Stainless Steel
Mitsui Seiki offers the Vertex 550-5XB blade center for producing turbine blades from forgings, castings, barstock or solid billets of titanium and stainless steel.
Read MoreLeveraging Laser Technology
Bruce Boone says laser technology enables him to make specialized rings from titanium and other materials that his competitors can’t offer.
Read MoreHole Making as a Core Competency
This manufacturer leverages various nonconventional machining processes to create accurate holes in a range of tough materials. In fact, precision hole-making has become one of its specialties.
Read More“Right-Sized” Machine for Structural Aerospace Parts
This five-axis machine offers a compact footprint and atypical automated pallet changing system for small, yet challenging aerospace structural components.
Read MoreUse the Machine Tool to Machine Tools
This shop has developed various time-saving tool components by creating them internally, including one tooling solution now being used by other shops as well.
Read MoreTurn-Mill Machine Features Counter Spindle
WFL’s M80-G Millturn features a counter spindle and is available with distances between centers measuring 2,000, 3,000, 4,500 or 6,000 mm.
Read MoreHMC Designed to Boost Productivity
The HU63EX horizontal machining center from Mitsui Seiki is designed to boost metalworking productivity.
Read MoreCNC Turning Center for High-Production Applications
Goodway’s GLS-1500 series CNC turning center, available from Yama Seiki, features a 30-degree slant-bed casting design said to provide smoother chip disposal and easier operator access.
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